1.     Comparison Of CERAMIC DPC To Other Technologies?

Key Attributes


Thin Film 

Thick Film 

Conductor Electrical Conductivity

Very good. Thick copper conductor.

Poor conductivity due to very thin film thickness.

Good conductivity. Lowered by presence of glass phase.

Via Electrical Conductivity

Very good. Vias filled with pure copper.

Very good. Vias filled with pure copper.

Poor. Vias filled with 50% metal and 50% glass or pores.

Feature Resolution

Goood. Depends on Cu thickness.

Very good.

Goood. Determined by screen print capability.


Low to moderate. Vias and metal deposited in same process. 
Low cost substrate.

High cost. Expensive substrate. Lapp and polish required after via deposition.

Low to moderate. Expensive metal pastes. Low cost substrate and low cost deposition technology.

Thermal Performance

Very good. AIN or alumina substrate and high thermal conductivity metal.

Good. AIN or alumina substrate. Metal layer too thin for heat spreading.

Moderate. Alumina substrate. Conductivity through the metal is poor due to glass phase.

Suitability for Power Applications

Very suitable. Copper conductors carry high currents.

Not suitable. Thin film layers can not carry high currents.

Suitable. Conductors with glass phase have moderate conductivity.

Suitability for High Frequency Applications

Suitable. Good conductivity and line resolution

Very suitable. Excellent line resolution.

Not suitable.




No. Often contain Pb additives.